通道应变对应变al0.40 in0.60 sb /Al0.25In0.75Sb阶梯缓冲Ga1-xInxSb HEMT结构电子输运性质的影响

K. Hatori, N. Kishimoto, M. Hiraoka, Y. Endoh, K. Osawa, T. Hayashi, Y. Kemmochi, R. Machida, I. Watanabe, Y. Yamashita, S. Hara, A. Kasamatsu, A. Endoh, H. Fujishiro
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引用次数: 0

摘要

利用应变al0.40 in0.60 sb /Al0.25In0.75Sb阶梯缓冲液,研究了通道内应变对Ga1-xInxSb通道HEMT结构(x = 0.60, 0.78, 0.85, 0.90和0.94)电子输运性质的影响。Ga1-xInxSb通道的应变由Al0.25In0.75Sb下缓冲液决定。电子迁移率(μ)在x = 0.78时达到最大值。由于量子阱最深,薄片电子密度(Ns)在x = 0.60(拉伸应变)处达到最大值。我们获得了Ga0.22In0.78Sb通道的最小片电阻(Rs)为202 Ω/□。通过降低螺纹位错密度,μ可达到近30,000 cm2/Vs。
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Effect of Strain in Channel on Electron Transport Properties of Ga1-xInxSb HEMT Structures with Strained-Al0.40In0.60Sb/Al0.25In0.75Sb Stepped Buffer
We investigated the effect of strain in channel on the electron transport properties of Ga1-xInxSb channel HEMT structures (x = 0.60, 0.78, 0.85, 0.90 and 0.94) with the strained-Al0.40In0.60Sb/Al0.25In0.75Sb stepped buffer. The strain in Ga1-xInxSb channel is determined by the Al0.25In0.75Sb lower buffer. The electron mobility (μ) showed the maximum value at x = 0.78 (unstrained). The sheet electron density (Ns) showed the maximum value at x = 0.60 (tensile strained) due to the deepest quantum well. We obtained the minimum sheet resistance (Rs) of 202 Ω/□ for the Ga0.22In0.78Sb channel. The μ may reach nearly 30,000 cm2/Vs by reducing threading dislocation density.
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