{"title":"Sn-3.0Ag-0.5Cu/C194对的界面反应","authors":"Xinyue Hu, Jun-Bo Wen, Y. Yen","doi":"10.23919/ICEP55381.2022.9795609","DOIUrl":null,"url":null,"abstract":"The solid-liquid interfacial reactions between Sn- 3.0Ag-0.5Cu solder and C194 substrate reacted at 240, 255 and 270°C for 0.5, 1, 2, 4 and 8 h were investigated. Optical microscope, scanning electron microscope, and energy dispersive spectrometer were used to determine intermetallic compounds (IMCs). The results indicated that the Cu6Sn5 and Cu3Sn phases with a small Fe solubility were formed at the interface. The IMCs thickness was increased with the increased of the reaction times. The (Cu, Fe)6Sn5 phase was gradually detached from the C194, when the reaction temperature and time was increased.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples\",\"authors\":\"Xinyue Hu, Jun-Bo Wen, Y. Yen\",\"doi\":\"10.23919/ICEP55381.2022.9795609\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The solid-liquid interfacial reactions between Sn- 3.0Ag-0.5Cu solder and C194 substrate reacted at 240, 255 and 270°C for 0.5, 1, 2, 4 and 8 h were investigated. Optical microscope, scanning electron microscope, and energy dispersive spectrometer were used to determine intermetallic compounds (IMCs). The results indicated that the Cu6Sn5 and Cu3Sn phases with a small Fe solubility were formed at the interface. The IMCs thickness was increased with the increased of the reaction times. The (Cu, Fe)6Sn5 phase was gradually detached from the C194, when the reaction temperature and time was increased.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795609\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795609","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples
The solid-liquid interfacial reactions between Sn- 3.0Ag-0.5Cu solder and C194 substrate reacted at 240, 255 and 270°C for 0.5, 1, 2, 4 and 8 h were investigated. Optical microscope, scanning electron microscope, and energy dispersive spectrometer were used to determine intermetallic compounds (IMCs). The results indicated that the Cu6Sn5 and Cu3Sn phases with a small Fe solubility were formed at the interface. The IMCs thickness was increased with the increased of the reaction times. The (Cu, Fe)6Sn5 phase was gradually detached from the C194, when the reaction temperature and time was increased.
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