{"title":"低功耗SoC内存BIST","authors":"Yuejian Wu, A. Ivanov","doi":"10.1109/DFT.2006.39","DOIUrl":null,"url":null,"abstract":"With the ever increasing number of memories embedded in a system-on-chip (SoC), power dissipation due to test has become a serious concern. This paper studies power dissipation in SRAMs and proposes a novel low power memory BIST. Its effectiveness is evaluated on memories in 130 and 90 nm technologies. As demonstrated, up to 30% power reduction can be achieved with virtually zero hardware overhead","PeriodicalId":113870,"journal":{"name":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Low Power SoC Memory BIST\",\"authors\":\"Yuejian Wu, A. Ivanov\",\"doi\":\"10.1109/DFT.2006.39\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the ever increasing number of memories embedded in a system-on-chip (SoC), power dissipation due to test has become a serious concern. This paper studies power dissipation in SRAMs and proposes a novel low power memory BIST. Its effectiveness is evaluated on memories in 130 and 90 nm technologies. As demonstrated, up to 30% power reduction can be achieved with virtually zero hardware overhead\",\"PeriodicalId\":113870,\"journal\":{\"name\":\"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DFT.2006.39\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFT.2006.39","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
With the ever increasing number of memories embedded in a system-on-chip (SoC), power dissipation due to test has become a serious concern. This paper studies power dissipation in SRAMs and proposes a novel low power memory BIST. Its effectiveness is evaluated on memories in 130 and 90 nm technologies. As demonstrated, up to 30% power reduction can be achieved with virtually zero hardware overhead