用变分法统一MOSFET标度理论

Ping He, Wensong Chen, L. Tian, Litian Liu, Zhijian Li
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引用次数: 0

摘要

利用变分法求解了MOSFET器件区域的二维泊松方程,包括栅极氧化区、耗尽区和埋地氧化区(SOI器件)。推导出了MOSFET电位分布的解析表达式和新的自然栅长度尺度。在此推导中可以考虑到正极介电介质、后门介电介质和硅膜的二维效应。利用该模型考察了电等效氧化厚度近似的有效性。利用该模型对均匀沟道掺杂大块MOSFET、本征沟道掺杂大块MOSFET、SOI MOSFET和双门控MOSFET的短沟道效应进行了比较。利用二维器件模拟器MEDICI进行了二维数值模拟,验证了实验结果。
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Unified MOSFET scaling theory using variational method
Using the variational method, the two dimensional Poisson Equation is solved in the MOSFET device region including the gate oxide region, depletion region and buried oxide region (for SOI device). An analytical expression for the potential distribution together with a new natural gate length scale for MOSFET is derived. The 2-D effects in front gate dielectric, back gate dielectric and silicon film can all be taken into account in this derivation. The validity of electrical equivalent oxide thickness approximation is also investigated using this model. Comparison of the short channel effect for uniform channel doping bulk MOSFET, intrinsic channel doping bulk MOSFET, SOI MOSFET and double gated MOSFET is conducted using our model. The results are verified by 2D numerical simulation using the 2D device simulator MEDICI.
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