针对恶劣环境的晶圆级封装MEMS的低温焊接和薄膜封装

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947408

Chengkuo Lee

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引用次数: 0

摘要

综述了低温共晶焊料作为晶圆键合MEMS封装的中间层材料，以及薄膜封装在晶圆级真空封装中的应用。研究了MEMS微镜、微继电器和NEMS开关的晶圆级真空封装技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Low-temperature solder bonding and thin film encapsulation for wafer level packaged MEMS aiming at harsh environment

Low temperature eutectic solder as an intermediate layer materials for wafer bonding based MEMS packaging, and thin film encapsulation for wafer level vacuum packaging are reviewed. Wafer level vacuum packaging technologies for MEMS micromirrors, micro-relays and NEMS switches are investigated.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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