S. Bhagavatheeswaran, T. Cummings, Eric Tangen, M. Heins, R. Chan, C. Steinbeiser
{"title":"基于0.13 μm SiGe BiCMOS技术的56 Gb/s PAM-4线性透阻放大器","authors":"S. Bhagavatheeswaran, T. Cummings, Eric Tangen, M. Heins, R. Chan, C. Steinbeiser","doi":"10.1109/CSICS.2017.8240445","DOIUrl":null,"url":null,"abstract":"This paper describes the implementation of a state-of-the art 56Gb/s single-channel linear transimpedance amplifier (TIA) integrated circuit for PAM-4/NRZ/DMT modulation formats used in data center interconnects (DCI) and base station front haul applications. Fabricated in 130nm SiGe BiCMOS process, the TIA has a single-ended input, differential output configuration, with nominal maximum DC transimpedance gain of ∼5.8 kQ (75 dB), gain dynamic range of 28 dB, average input referred noise (IRN) of 14.9 pA/VHz, typical bandwidth of 38 GHz across the entire gain dynamic range, Total Harmonic Distortion (THD) of 2% for output of 500mVppd, adjustable output voltage swing up to 1Vppd, all operated with typical supply of 3.3 V. At 2.8 V supply, bandwidth of 34 GHz has been achieved. Performance has been measured from −5C to 95C. The TIA has Receive Signal Strength Indicator (RSSI) for measuring the input signal strength, peak detect (PKD) function for measuring the output amplitude and in-built photo-diode (PD) cathode bias network. The chip can be operated in manual gain control (MGC) or automatic gain control (AGC) mode. The die area is 1.6 mmA2. A state-of-the art 4-level Pulse Amplitude Modulation (PAM-4) eye diagram at 56Gb/s has been demonstrated with this linear TIA. The Die has been integrated into an optical product from Discovery Semiconductors and several optical interconnect products.","PeriodicalId":129729,"journal":{"name":"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"62 12","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A 56 Gb/s PAM-4 linear transimpedance amplifier in 0.13-μm SiGe BiCMOS technology for optical receivers\",\"authors\":\"S. Bhagavatheeswaran, T. Cummings, Eric Tangen, M. Heins, R. Chan, C. Steinbeiser\",\"doi\":\"10.1109/CSICS.2017.8240445\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the implementation of a state-of-the art 56Gb/s single-channel linear transimpedance amplifier (TIA) integrated circuit for PAM-4/NRZ/DMT modulation formats used in data center interconnects (DCI) and base station front haul applications. Fabricated in 130nm SiGe BiCMOS process, the TIA has a single-ended input, differential output configuration, with nominal maximum DC transimpedance gain of ∼5.8 kQ (75 dB), gain dynamic range of 28 dB, average input referred noise (IRN) of 14.9 pA/VHz, typical bandwidth of 38 GHz across the entire gain dynamic range, Total Harmonic Distortion (THD) of 2% for output of 500mVppd, adjustable output voltage swing up to 1Vppd, all operated with typical supply of 3.3 V. At 2.8 V supply, bandwidth of 34 GHz has been achieved. Performance has been measured from −5C to 95C. The TIA has Receive Signal Strength Indicator (RSSI) for measuring the input signal strength, peak detect (PKD) function for measuring the output amplitude and in-built photo-diode (PD) cathode bias network. The chip can be operated in manual gain control (MGC) or automatic gain control (AGC) mode. The die area is 1.6 mmA2. A state-of-the art 4-level Pulse Amplitude Modulation (PAM-4) eye diagram at 56Gb/s has been demonstrated with this linear TIA. The Die has been integrated into an optical product from Discovery Semiconductors and several optical interconnect products.\",\"PeriodicalId\":129729,\"journal\":{\"name\":\"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"62 12\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2017.8240445\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2017.8240445","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 56 Gb/s PAM-4 linear transimpedance amplifier in 0.13-μm SiGe BiCMOS technology for optical receivers
This paper describes the implementation of a state-of-the art 56Gb/s single-channel linear transimpedance amplifier (TIA) integrated circuit for PAM-4/NRZ/DMT modulation formats used in data center interconnects (DCI) and base station front haul applications. Fabricated in 130nm SiGe BiCMOS process, the TIA has a single-ended input, differential output configuration, with nominal maximum DC transimpedance gain of ∼5.8 kQ (75 dB), gain dynamic range of 28 dB, average input referred noise (IRN) of 14.9 pA/VHz, typical bandwidth of 38 GHz across the entire gain dynamic range, Total Harmonic Distortion (THD) of 2% for output of 500mVppd, adjustable output voltage swing up to 1Vppd, all operated with typical supply of 3.3 V. At 2.8 V supply, bandwidth of 34 GHz has been achieved. Performance has been measured from −5C to 95C. The TIA has Receive Signal Strength Indicator (RSSI) for measuring the input signal strength, peak detect (PKD) function for measuring the output amplitude and in-built photo-diode (PD) cathode bias network. The chip can be operated in manual gain control (MGC) or automatic gain control (AGC) mode. The die area is 1.6 mmA2. A state-of-the art 4-level Pulse Amplitude Modulation (PAM-4) eye diagram at 56Gb/s has been demonstrated with this linear TIA. The Die has been integrated into an optical product from Discovery Semiconductors and several optical interconnect products.