Reducing thermal resistance of DIP8 package based on leadframe optimization

With the trend towards ever-powerful chip and evermore-intense heat fluxes, the thermal issues of packages are becoming increasingly important for power ICs. One of the most effective approach to improve thermal management of ICs is leadframe optimization. In this paper, we present a revised leadframe of DIP8 package which includes a bigger die pad connecting to two pins. The simulation results and experimental data both indicate the new leadframe has a much better thermal performance than the old one. Due to the lower thermal resistance and more heat conductive paths with low thermal resistance, the junction temperature has dramatically declined in the same ambient condition.