采用3D-MMIC技术的高度集成x波段频率四倍器MMIC

Y. Yamaguchi, T. Kaho, K. Uehara
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引用次数: 7

摘要

提出了一种采用三维MMIC (3D-MMIC)技术的高集成度x波段四倍频MMIC。它由四个放大器,两个倍频器和一个2波段消除滤波器组成。这七个电路集成在2.25 mm × 1.05 mm的芯片上。第三和第五谐波分量是最接近所需分量的杂散分量,它们被很好地抑制。理想/不理想的比值约为40分贝。MMIC在低至- 10dbm的输入功率下提供+ 5dbm的四次谐波分量。MMIC的功耗仅为160 mW。
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A Highly Integrated X-band Frequency Quadrupler MMIC using 3D-MMIC Technology
A highly integrated X-band frequency quadrupler MMIC using three-dimensional MMIC (3D-MMIC) technology is presented. It consists of four amplifiers, two doublers, and a 2-band elimination filter. These seven circuits are integrated on only a 2.25 mm times 1.05 mm chip. The third and fifth harmonic components, which are spurious components nearest to the desired component, are well suppressed. The desired/undesired ratio is about 40 dB. The MMIC supplies +5 dBm of the fourth harmonic component at input power as low as -10 dBm. The power dissipation of the MMIC is only 160 mW.
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