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2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium最新文献

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A 2.4-GHz LC-Tank VCO with Minimum Supply Pushing Regulation Technique 基于最小供电推进调节技术的2.4 ghz LC-Tank压控振荡器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380848
Xuejin Wang, B. Bakkaloglu
Design of low drop-out (LDO) supply regulated 2.4 GHz low phase noise LC-tank voltage controlled oscillator (VCO) is presented. Low-frequency supply noise sensitivity of the VCO phase noise is derived, and output noise and power supply rejection (PSR) profile of the LDO is optimized for minimum supply pushing. The LDO PSR and output noise is optimized by shaping the LDO AC response and tuning the equivalent-series resistance (ESR) of the bypass capacitor, while achieving maximum LDO current efficiency. To verify the results, two 2.4 GHz LC-tank VCOs, with a PMOS and an NMOS switching pair respectively with associated PMOS supply regulators are designed and fabricated in a 0.18 mum, 7-layer metal CMOS process. The implemented VCOs achieve less than 95 dBc/Hz phase noise at 100 kHz offset with a current consumption of 2.2 mA. By utilizing the proposed regulator AC loop shaping, the VCO phase noise sensitivity to supply noise is improved by 30 dB for offset frequency up to 10 MHz with no phase noise peaking.
提出了一种2.4 GHz低相位噪声LC-tank压控振荡器(VCO)的设计方案。推导了压控振荡器相位噪声的低频电源噪声灵敏度,并优化了LDO的输出噪声和电源抑制(PSR)曲线,以实现最小的电源推压。LDO PSR和输出噪声通过塑造LDO交流响应和调整旁路电容的等效串联电阻(ESR)来优化,同时实现最大的LDO电流效率。为了验证结果,设计并制造了两个2.4 GHz LC-tank vco,分别具有PMOS和NMOS开关对以及相关的PMOS电源稳压器,采用0.18 μ m, 7层金属CMOS工艺。所实现的vco在100 kHz偏置下的相位噪声小于95 dBc/Hz,电流消耗为2.2 mA。通过利用所提出的调节器交流环路整形,在失调频率高达10 MHz的情况下,压控振荡器对电源噪声的相位噪声灵敏度提高了30 dB,且无相位噪声峰值。
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引用次数: 7
A Highly Integrated X-band Frequency Quadrupler MMIC using 3D-MMIC Technology 采用3D-MMIC技术的高度集成x波段频率四倍器MMIC
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380993
Y. Yamaguchi, T. Kaho, K. Uehara
A highly integrated X-band frequency quadrupler MMIC using three-dimensional MMIC (3D-MMIC) technology is presented. It consists of four amplifiers, two doublers, and a 2-band elimination filter. These seven circuits are integrated on only a 2.25 mm times 1.05 mm chip. The third and fifth harmonic components, which are spurious components nearest to the desired component, are well suppressed. The desired/undesired ratio is about 40 dB. The MMIC supplies +5 dBm of the fourth harmonic component at input power as low as -10 dBm. The power dissipation of the MMIC is only 160 mW.
提出了一种采用三维MMIC (3D-MMIC)技术的高集成度x波段四倍频MMIC。它由四个放大器,两个倍频器和一个2波段消除滤波器组成。这七个电路集成在2.25 mm × 1.05 mm的芯片上。第三和第五谐波分量是最接近所需分量的杂散分量,它们被很好地抑制。理想/不理想的比值约为40分贝。MMIC在低至- 10dbm的输入功率下提供+ 5dbm的四次谐波分量。MMIC的功耗仅为160 mW。
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引用次数: 7
A Miniature, Folded-Switching, Up-conversion Mixer for UWB Applications Using 0.18-μ CMOS Process 一种基于0.18 μ CMOS工艺的超宽带微型折叠开关上转换混频器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380933
Pin-Cheng Huang, F. Chang, Shih-Fong Chao, Huei Wang
This paper presents a compact up-conversion mixer using commercial 0.18-μm CMOS technology for UWB system applications. To achieve broadband frequency response, low power consumption, and small chip size simultaneously, the folded structure and inductor-free matching network are adopted. The measured mixer demonstrates a measured wideband response from 1 to 11 GHz with a conversion loss of lower than 6 dB. The dc power consumption is 25 mW under a supply voltage of 1.8-V, with a compact chip size of 0.5 mm times 0.6 mm.
本文提出了一种紧凑的上变频混频器,采用商用0.18 μm CMOS技术,用于超宽带系统。为了同时实现宽带频响、低功耗和小芯片尺寸,采用了折叠结构和无电感匹配网络。测量的混频器显示了从1到11 GHz的测量宽带响应,转换损耗低于6 dB。在1.8 v供电电压下,直流功耗为25mw,芯片尺寸紧凑,为0.5 mm × 0.6 mm。
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引用次数: 9
A 90nm CMOS Doherty Power Amplifier with Integrated Hybrid Coupler and Impedance Transformer 一种集成混合耦合器和阻抗变压器的90nm CMOS Doherty功率放大器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380915
M. Elmala, R. Bishop
An OFDM capable Doherty PA is implemented in 90 nm CMOS with integrated quadrature hybrid and impedance transformer. The two amplifiers are optimized to minimize AM-PM distortion. The PA achieves 25 dBm Psa, using 1.4 V supply with 24% PAE, and operates over 1 GHz of frequency range (from 4 GHz to 5 GHz). 3 dB to 6 dB back-off from P1dB is required to achieve -25 dB measured EVM across this band, making it suitable for WLAN and WiMAX applications. The measured AM-PM distortion varies from 4deg to 12.5deg across the 1 GHz range.
一个支持OFDM的Doherty PA在90 nm CMOS中实现,集成了正交混合和阻抗变压器。两个放大器进行了优化,以尽量减少AM-PM失真。该放大器使用1.4 V电源和24% PAE实现25 dBm Psa,工作频率范围为1 GHz(从4 GHz到5 GHz)。要在该频段内实现-25 dB的测量EVM,需要从P1dB后退3 dB至6 dB,使其适用于WLAN和WiMAX应用。测量的AM-PM失真在1ghz范围内从4度到12.5度不等。
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引用次数: 15
Design and Layout Techniques for the Optimization of nMOS SPDT Series-Shunt Switches in a 130nm SiGe BiCMOS Technology 在130nm SiGe BiCMOS技术中优化nMOS SPDT系列并联开关的设计和布局技术
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380923
J. Comeau, J. Cressler, M. Mitchell
This work investigates various design and layout optimization approaches for MOSFET-based series-shunt, single-pole double-throw (SPDT) switches in a commercially-available 130 nm silicon-germanium (SiGe) BiCMOS technology. The incorporation of deep-trench isolation, additional substrate contacts, and additional gate resistance for the series nMOS device are examined, and the impact of these design and layout optimizations on the switches insertion loss, bandwidth, isolation and linearity performance have been quantified across frequency. This experiment has yielded a SPDT switch with an insertion loss of - 1.4 dB, -1.5 dB, and -2.0 dB, at 5.8 GHz, 10 GHz, and 20 GHz, respectively, and an input-referred third-order intercept point (II P3) of 21 dBiu at 9.5 GHz, without the use of any process adders or additional supply voltages.
本研究研究了基于mosfet的串联分流、单极双掷(SPDT)开关在商用130纳米硅锗(SiGe) BiCMOS技术中的各种设计和布局优化方法。研究了系列nMOS器件的深沟槽隔离、附加衬底触点和附加栅极电阻的结合,并对这些设计和布局优化对开关插入损耗、带宽、隔离和线性性能的影响进行了跨频率量化。该实验产生了一个SPDT开关,在5.8 GHz、10 GHz和20 GHz时,其插入损耗分别为- 1.4 dB、-1.5 dB和-2.0 dB,在9.5 GHz时,其输入参考三阶截距点(II P3)为21 dBiu,而无需使用任何过程加器或额外的电源电压。
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引用次数: 9
Development of Long-Range UHF-band RFID Tag chip Using Schottky Diodes in Standard CMOS Technology 基于标准CMOS技术的肖特基二极管远程超高频RFID标签芯片的研制
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380883
N. Tran, Bomson Lee, Jong-Wook Lee
We present the design of three key building blocks for UHF-band passive RFID tag chip, i.e., voltage multiplier, ASK demodulator, and internal clock generator. An analysis on a simple equivalent circuit of RFID tag chip for long reading range is presented taking into account the finite turn-on voltage of tag chip. The Schottky diodes used in the passive RFID tag chip were fabricated using titanium (Ti/Al/Ta/Al)-silicon (n-type) junction in 0.35 mum CMOS process, and the effect of size of Schottky diode on the turn-on voltage and the input impedance of the voltage multiplier was investigated. For 300 mV RF input voltage, the fabricated voltage multiplier using Schottky diodes generated output voltages of 1.5 V and corresponding voltage conversion efficiency of 45%. In addition, we propose an example circuit for internal oscillator of tag chip with digital calibration, which can generate precise copy of RFID reader timing signals.
我们提出了uhf频段无源RFID标签芯片的三个关键构建模块的设计,即电压乘法器,ASK解调器和内部时钟发生器。考虑到标签芯片的导通电压有限,对一种简单的RFID标签芯片等效电路进行了分析。采用0.35 μ m CMOS工艺,采用钛(Ti/Al/Ta/Al)-硅(n型)结制备了用于无源RFID标签芯片的肖特基二极管,并研究了肖特基二极管尺寸对电压乘数器导通电压和输入阻抗的影响。当射频输入电压为300 mV时,利用肖特基二极管制作的电压倍增器输出电压为1.5 V,相应的电压转换效率为45%。此外,我们还提出了一种带有数字校准的标签芯片内部振荡器示例电路,该电路可以精确地复制RFID阅读器的时序信号。
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引用次数: 87
A 0.18-/spl mu/m CMOS Low-spurious Local Signal Generator for MB-OFDM UWB Radio 一种用于MB-OFDM UWB无线电的0.18-/spl μ m CMOS低杂散本地信号发生器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380868
T. Tokairin, N. Matsuno, K. Numata, T. Maeda, S. Tanaka
This paper presents a new single PLL and single SSB-mixer architecture for a local signal generator of the Mode-1 MB-OFDM UWB systems. Using a VCO running at 8976 MHz and a divide-by-2 circuit, it can provide a 4488-MHz carrier signal with low-spurious levels, which is required to meet the spectrum mask requirements being considered in Japan and Europe. A divide-by-8.5/17 circuit using double-edge triggered operation is introduced to obtain 3432-and 3960-MHz carriers from the same VCO in order to save die area. This circuit generates 1056-and 528-MHz signals, and the required signals can be obtained by mixing these with 4488 MHz signal. The core area of the local signal generator fabricated in a 0.18-mum CMOS technology is 0.67 mm2. The spurious levels for the 4488-MHz carrier are below -41 dBc.
本文提出了一种用于Mode-1 MB-OFDM UWB系统本地信号发生器的单锁相环和单ssb混频器结构。使用运行在8976 MHz的VCO和除以2电路,它可以提供低杂散电平的4488 MHz载波信号,这需要满足日本和欧洲正在考虑的频谱掩码要求。为了节省芯片面积,引入了一种采用双边触发运算的除以8.5/17电路,从同一个VCO中获得3432-和3960-MHz的载波。该电路产生1056- MHz和528-MHz的信号,将它们与4488 MHz的信号混合即可得到所需的信号。采用0.18 μ m CMOS技术制造的局部信号发生器的核心面积为0.67 mm2。4488-MHz载波的杂散电平低于-41 dBc。
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引用次数: 4
A 900-MHz Direct-Conversion Transceiver for Mobile RFID Systems 用于移动RFID系统的900 mhz直接转换收发器
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380882
Jong-Eun Jang, Hoon Lee, Seung-Wan Choi, K. Ahn, Myoung-Sub Jung, Eui-Seok Song, Juno Kim, Hyoung-Hwan Ron, Gi-Beom Kim, Sung-Woo Bae, Ha-Ryoung Oh, Y. Seong, Jun-Seok Park
A fully integrated 900-MHz direct-conversion transceiver for mobile RFID system is presented. The transceiver consists of a low noise amplifier, a down-conversion mixer, a band pass filter, and programmable gain amplifier (PGA) for RX path; and a power amplifier, an up-conversion mixer, a low-pass filter, and a PGA for TX path. In addition, the fractional N PLL is integrated to cover different frequency standards for different nations. The transceiver meets the dense reader environment specifications.
提出了一种用于移动RFID系统的全集成900 mhz直接转换收发器。收发器由低噪声放大器、下变频混频器、带通滤波器和用于RX路径的可编程增益放大器(PGA)组成;以及功率放大器、上转换混频器、低通滤波器和用于TX路径的PGA。此外,分数N锁相环被集成以覆盖不同国家的不同频率标准。收发器满足密集读写器环境要求。
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引用次数: 14
A Low-Power Low-Noise Single-Chip Receiver Front-End for Automotive Radar at 77 GHz in Silicon-Germanium Bipolar Technology 基于硅锗双极技术的77 GHz汽车雷达低功耗低噪声单芯片接收机前端
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380853
M. Hartmann, C. Wagner, K. Seemann, J. Platz, H. Jager, R. Weigel
This paper presents a single chip receiver front-end, including low-noise amplifier and mixer, for application in automotive radar systems at 77 GHz. The circuit has been implemented in a SiGe HBT technology. The complete circuit occupies 1030 times 1130 mum2 including bond pads and dissipates 440 mW from a 5.5 V supply. The front-end shows a minimum measured single sideband noise figure (SSB NF) of 11.5 dB and a maximum conversion gain of 30 dB at 77 GHz. Linearity measurements show a 1 dB input compression point of -26 dBm and a third order intercept point of -21.6 dBm at 77 GHz.
本文介绍了一种用于77 GHz汽车雷达系统的单片接收前端,包括低噪声放大器和混频器。该电路已在SiGe HBT技术中实现。完整的电路占用1030乘以1130 mum2,包括键合垫,从5.5 V电源消耗440兆瓦。前端显示最小测量的单边带噪声系数(SSB NF)为11.5 dB,在77 GHz时最大转换增益为30 dB。线性测量显示,在77 GHz时,1 dB输入压缩点为-26 dBm,三阶截距点为-21.6 dBm。
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引用次数: 36
Achieving Wideband sub-1dB Noise Figure and High Gain with MOSFETs if Input Power Matching is not Required 在不需要输入功率匹配的情况下,利用mosfet实现宽带sub-1dB噪声系数和高增益
Pub Date : 2007-06-03 DOI: 10.1109/RFIC.2007.380972
E. Klumperink, Qiaohui Zhang, G. Wienk, R. Witvers, J. B. D. Vaate, B. Woestenburg, B. Nauta
A 0.18 mum CMOS low noise amplifier (LNA) achieves sub-1 dB noise figure over more than an octave of bandwidth without external noise matching components. It is designed for a future radio telescope, requiring millions of cheap LNAs mounted directly on phased array antenna elements. The short distance between antenna and LNA and low frequency below 2 GHz allows for using an LNA with reflective input impedance, increasing the gain with 6 dB. Without any matching network, very low noise figure is achieved over a wide bandwidth. At 90 mW power, sub-1 dB Noise is achieved for 50 Omega source impedance over a 0.8-1.8 GHz band without external coils, and S21>20 dB, OIP2>25 dBm and OIP3>15 dBm. Preliminary results with 150 Omega source impedance show noise temperatures as low as 25 K around 900 MHz.
0.18 μ m CMOS低噪声放大器(LNA)在没有外部噪声匹配元件的情况下,在超过一个倍频的带宽上实现低于1 dB的噪声值。它是为未来的射电望远镜设计的,需要数百万个廉价的lna直接安装在相控阵天线元件上。由于天线与LNA之间的距离较短,且频率低于2 GHz,因此可以使用具有反射输入阻抗的LNA,从而增加6 dB的增益。在没有任何匹配网络的情况下,可以在很宽的带宽上实现很低的噪声系数。在功率为90 mW时,在0.8-1.8 GHz频带上,在无外部线圈的情况下,源阻抗为50 ω,噪声低于1 dB, S21>20 dB, OIP2>25 dBm, OIP3>15 dBm。150 ω源阻抗的初步结果显示噪声温度在900 MHz左右低至25 K。
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引用次数: 24
期刊
2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
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