mosfet中产生的过程感应电荷及相关收集测试结构的分析

P. Dars, R. Basset, G. Merckel
{"title":"mosfet中产生的过程感应电荷及相关收集测试结构的分析","authors":"P. Dars, R. Basset, G. Merckel","doi":"10.1109/ICMTS.1990.161712","DOIUrl":null,"url":null,"abstract":"The use of gate isolated test transistors can lead to the creation of process-induced charges which cannot occur on transistors implemented on circuits. A test structure has been designed to separate the intrinsic process related defects which can result in yield losses on circuits, and the charges or states created in the devices usually used in test patterns. With the use of this collection test structure (CTS), the influence of the different process steps in terms of creation of charges can be identified; in particular, the role of the last steps can be pointed out.<<ETX>>","PeriodicalId":417292,"journal":{"name":"Proceedings of the 1991 International Conference on Microelectronic Test Structures","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Analysis of process-induced charges created in MOSFETs and related collection test structures\",\"authors\":\"P. Dars, R. Basset, G. Merckel\",\"doi\":\"10.1109/ICMTS.1990.161712\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The use of gate isolated test transistors can lead to the creation of process-induced charges which cannot occur on transistors implemented on circuits. A test structure has been designed to separate the intrinsic process related defects which can result in yield losses on circuits, and the charges or states created in the devices usually used in test patterns. With the use of this collection test structure (CTS), the influence of the different process steps in terms of creation of charges can be identified; in particular, the role of the last steps can be pointed out.<<ETX>>\",\"PeriodicalId\":417292,\"journal\":{\"name\":\"Proceedings of the 1991 International Conference on Microelectronic Test Structures\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 1991 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1990.161712\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1991 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1990.161712","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

栅极隔离测试晶体管的使用会导致过程感应电荷的产生,而这种电荷不会发生在电路上实现的晶体管上。设计了一种测试结构,以分离可能导致电路产量损失的内在过程相关缺陷,以及通常用于测试模式的设备中产生的电荷或状态。通过使用这种收集测试结构(CTS),可以确定不同工艺步骤对产生电荷的影响;特别是,最后步骤的作用可以指出。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Analysis of process-induced charges created in MOSFETs and related collection test structures
The use of gate isolated test transistors can lead to the creation of process-induced charges which cannot occur on transistors implemented on circuits. A test structure has been designed to separate the intrinsic process related defects which can result in yield losses on circuits, and the charges or states created in the devices usually used in test patterns. With the use of this collection test structure (CTS), the influence of the different process steps in terms of creation of charges can be identified; in particular, the role of the last steps can be pointed out.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Trench DRAM structures for the analysis of two- and three-dimensional leakage phenomena The vertical test structure for measuring contact resistance between two kinds of metal An ovenless electromigration test system environment using test chips with on-chip heating and computer controlled testing Material and process learning by noncontact characterization of minority carrier lifetime and surface recombination condition Edge effect prediction in real MOS insulator using test chips
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1