D. Drouin, Mohamed Amine-Bounouar, G. Droulers, M. Labalette, M. Pioro-Ladrière, A. Souifi, S. Ecoffey
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This presentation will address the potential of nanoelectronic devices 3D monolithic integration in the CMOS back-end-of-line (BEOL) to add functionality and enhance integrated circuits (ICs) performances.
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