接键顺序对GMR静电防护的影响

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI:10.1109/EOSESD.2000.890046

F.G. Zhao, R. Tao, Hong Tian

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引用次数: 2

摘要

在GMR头云台组件(HGA)和头堆栈组件(HSA)过程中，ESD保护的关键问题之一是如何防止“金属接触”，即GMR传感器与金属的直接接触。本文介绍了一种非常有效的方法，可以在无法避免“金属接触”的HGA和HSA工艺中提供更好的ESD保护。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The effect of bonding sequence on GMR ESD protection

One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent "metal contact", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA and HSA processes where the "metal contact" cannot be avoided.

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Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)

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