{"title":"一种用于高温操作的倒装芯片安装新技术","authors":"A. Basu, T. Itoh","doi":"10.1109/EPEP.1997.634047","DOIUrl":null,"url":null,"abstract":"A new method is described for mounting microwave semiconductor devices on a circuit board in a flip-chip configuration, which overcomes the limitations on the maximum temperature of operation encountered in conventional bonding techniques such as soldering. This method uses electro-deposited copper to form the contacts, and temperature limitation comes only from the device itself.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new flip-chip mounting technique for high temperature operation\",\"authors\":\"A. Basu, T. Itoh\",\"doi\":\"10.1109/EPEP.1997.634047\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new method is described for mounting microwave semiconductor devices on a circuit board in a flip-chip configuration, which overcomes the limitations on the maximum temperature of operation encountered in conventional bonding techniques such as soldering. This method uses electro-deposited copper to form the contacts, and temperature limitation comes only from the device itself.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634047\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new flip-chip mounting technique for high temperature operation
A new method is described for mounting microwave semiconductor devices on a circuit board in a flip-chip configuration, which overcomes the limitations on the maximum temperature of operation encountered in conventional bonding techniques such as soldering. This method uses electro-deposited copper to form the contacts, and temperature limitation comes only from the device itself.
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