表面改性对铝衬垫阵列超声键合的影响

2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI:10.23919/ICEP55381.2022.9795479

Pin Li, Yang-Chun Fan, Wallace Chuang, E. Schellkes, K. Yasuda, Jenn-Ming Song

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引用次数: 0

摘要

本研究利用超声波技术开发并优化了多级装配的Al-to-Al直接键合。采用减法制备溅射铝衬垫。系统地研究了等离子体预处理对接头强度的影响。实验结果表明，除表面粗糙度和表面硬度外，受等离子体气体和输入功率影响的表面能是影响铝铝直接键合的主要因素。

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Surface Modification Effect on Ultrasonic Bonding for Aluminum Pad Arrays

This study develops and optimizes Al-to-Al direct bonding for multi-level assembly using ultrasonic technique. Sputtered Al pads prepared by subtractive method were adopted. Effects of plasma pretreatment on joint strength are systematically investigated. Other than surface roughness and surface hardness, experimental results suggest that surface energy, which was affected by the plasma gas and input power, is the dominating factor for Al-Al direct bonding.

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2022 International Conference on Electronics Packaging (ICEP)

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