三维微电子集成

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105) Pub Date : 1998-10-21 DOI:10.1109/ICSICT.1998.786099

R. Bower

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摘要

在过去的二十年里，各种各样的技术被应用于三维微观结构的形成。在这次演讲中，作者描述了他的团队使用直接键合和智能切割技术形成三维结构的工作。

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3-dimensional microelectronic integration

A variety of technologies have been applied to the formation of three-dimensional microstructures in the past two decades. In this talk the author describes work in his group to form three-dimensional structures using direct bonding and smart cut techniques.

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1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)

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