W. Deal, K. Leong, A. Zamora, B. Gorospe, K. Nguyen, X. Mei
{"title":"用于太赫兹通信的660ghz上变频器","authors":"W. Deal, K. Leong, A. Zamora, B. Gorospe, K. Nguyen, X. Mei","doi":"10.1109/CSICS.2017.8240460","DOIUrl":null,"url":null,"abstract":"This paper reports on a 660 GHz transmitter using InP HEMT technology. The transmitter features a x18 multiplier chain, sub-harmonic mixer, and a power amplifier at the output. Tradeoffs in the upconverter topology are discussed, including transmit noise power, RF filtering, and phase noise. With SSPA at the output, this up-converter achieves the highest reported power to date at this frequency. This significantly advances the technology required for submillimeter wave communication.","PeriodicalId":129729,"journal":{"name":"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"A 660 GHz up-converter for THz communications\",\"authors\":\"W. Deal, K. Leong, A. Zamora, B. Gorospe, K. Nguyen, X. Mei\",\"doi\":\"10.1109/CSICS.2017.8240460\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports on a 660 GHz transmitter using InP HEMT technology. The transmitter features a x18 multiplier chain, sub-harmonic mixer, and a power amplifier at the output. Tradeoffs in the upconverter topology are discussed, including transmit noise power, RF filtering, and phase noise. With SSPA at the output, this up-converter achieves the highest reported power to date at this frequency. This significantly advances the technology required for submillimeter wave communication.\",\"PeriodicalId\":129729,\"journal\":{\"name\":\"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2017.8240460\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2017.8240460","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper reports on a 660 GHz transmitter using InP HEMT technology. The transmitter features a x18 multiplier chain, sub-harmonic mixer, and a power amplifier at the output. Tradeoffs in the upconverter topology are discussed, including transmit noise power, RF filtering, and phase noise. With SSPA at the output, this up-converter achieves the highest reported power to date at this frequency. This significantly advances the technology required for submillimeter wave communication.
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