Package Reliability Evaluation of 600mm FOPLP with 6-Sided Die Protection with 0.35mm Ball Pitch

6-sided die protection on 600mm x 600mm Fan-Out Panel Level Packaging (FOPLP) has emerged as a scale up alternative to 300mm Fan-Out Wafer Level Packaging (FOWLP). In comparison to a 300mm round panel, a 600mm x 600mm panel could fit 5 times more 200mm wafers than a 300mm round panel. The need for migrating to carrier sizes larger than 300mm for FOWLP becomes a necessity to lower down costs and handle higher volumes. Although 600mm FOPLP is in its early stages of adoption by mainstream Wafer Level Packaging (WLP), questions arise on the performance and comparison to its 300mm FOWLP counterpart.As opposed to its 300mm round panel predecessor for 6-sided die protection with mold compound, several material sets used for panel processing had to be revisited such as polymer concentration for thin film and large panel processing for metal deposition such as seed layer and redistribution layers. Affects of photolithography on large panel and subsequent downstream process such as panel backside thinning will need to be considered for overall package reliability.This paper will describe the differences and similarities between 600mm x 600mm FOPLP and 300mm round panel FOWLP utilizing a 6-sided die protection process. We will review the key metrics that affect package reliability such as Fan-Out Ratio, thin film/build up process and scaling up from 300mm round panel FOWLP to 600mm FOPLP. Finally, we will present the package reliability performance between a 300mm FOWLP versus 600mm x 600mm FOPLP.