小模面积电容交叉耦合注入锁定分频器

W. Lai, S. Jang, Meng-Yan Fang
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引用次数: 1

摘要

本文介绍了采用TSMC标准0.18 μm CMOS工艺实现的电容式交叉耦合注入锁定分频器(ILFD)的低功耗和宽锁定范围。该ILFD基于电容交叉耦合压控振荡器,带有一个注入MOSFET,用于将外部信号耦合到谐振器。ILFD使用一个三维电感器来减小模具面积。在电源电压为1V时,分频器的自由工作频率为2.27 GHz,在入射功率为0 dBm时,分频器的锁定范围为1.5GHz ~ 7.4 GHz,约为5.9GHz(132.58%)。核心功耗为10.22mW。在低功耗模式下,ILFD具有更高的优值。模具面积为0.719×0.637 mm2。
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Small die area capacitive cross-coupled injection-locked frequency divider
This letter presents a lower power and wide locking range divide-by-2 with capacitive cross-coupled injection-locked frequency divider (ILFD) implemented in the TSMC standard 0.18 μm CMOS process. The ILFD is based on a capacitive cross-coupled VCO with one injection MOSFET for coupling the external signal to the resonator. The ILFD uses one 3-dimensional inductors to reduce the die area. At the supply voltage of 1V, the divider's free-running frequency is 2.27 GHz, and at the incident power of 0 dBm the locking range is about 5.9GHz (132.58%) from 1.5GHz to 7.4 GHz. The core power consumption is 10.22mW. At low power mode, the ILFD has higher figure of merit. The die area is 0.719×0.637 mm2.
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