{"title":"小模面积电容交叉耦合注入锁定分频器","authors":"W. Lai, S. Jang, Meng-Yan Fang","doi":"10.1109/ICAM.2017.8242127","DOIUrl":null,"url":null,"abstract":"This letter presents a lower power and wide locking range divide-by-2 with capacitive cross-coupled injection-locked frequency divider (ILFD) implemented in the TSMC standard 0.18 μm CMOS process. The ILFD is based on a capacitive cross-coupled VCO with one injection MOSFET for coupling the external signal to the resonator. The ILFD uses one 3-dimensional inductors to reduce the die area. At the supply voltage of 1V, the divider's free-running frequency is 2.27 GHz, and at the incident power of 0 dBm the locking range is about 5.9GHz (132.58%) from 1.5GHz to 7.4 GHz. The core power consumption is 10.22mW. At low power mode, the ILFD has higher figure of merit. The die area is 0.719×0.637 mm2.","PeriodicalId":117801,"journal":{"name":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Small die area capacitive cross-coupled injection-locked frequency divider\",\"authors\":\"W. Lai, S. Jang, Meng-Yan Fang\",\"doi\":\"10.1109/ICAM.2017.8242127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This letter presents a lower power and wide locking range divide-by-2 with capacitive cross-coupled injection-locked frequency divider (ILFD) implemented in the TSMC standard 0.18 μm CMOS process. The ILFD is based on a capacitive cross-coupled VCO with one injection MOSFET for coupling the external signal to the resonator. The ILFD uses one 3-dimensional inductors to reduce the die area. At the supply voltage of 1V, the divider's free-running frequency is 2.27 GHz, and at the incident power of 0 dBm the locking range is about 5.9GHz (132.58%) from 1.5GHz to 7.4 GHz. The core power consumption is 10.22mW. At low power mode, the ILFD has higher figure of merit. The die area is 0.719×0.637 mm2.\",\"PeriodicalId\":117801,\"journal\":{\"name\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICAM.2017.8242127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICAM.2017.8242127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Small die area capacitive cross-coupled injection-locked frequency divider
This letter presents a lower power and wide locking range divide-by-2 with capacitive cross-coupled injection-locked frequency divider (ILFD) implemented in the TSMC standard 0.18 μm CMOS process. The ILFD is based on a capacitive cross-coupled VCO with one injection MOSFET for coupling the external signal to the resonator. The ILFD uses one 3-dimensional inductors to reduce the die area. At the supply voltage of 1V, the divider's free-running frequency is 2.27 GHz, and at the incident power of 0 dBm the locking range is about 5.9GHz (132.58%) from 1.5GHz to 7.4 GHz. The core power consumption is 10.22mW. At low power mode, the ILFD has higher figure of merit. The die area is 0.719×0.637 mm2.