DRAM-CSP的备选碰撞工艺

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008299

R. Biedorf, R. Heinze, A. Wollanke, K. Wolter, T. Zerna, A. Plotzke

{"title":"DRAM-CSP的备选碰撞工艺","authors":"R. Biedorf, R. Heinze, A. Wollanke, K. Wolter, T. Zerna, A. Plotzke","doi":"10.1109/ECTC.2002.1008299","DOIUrl":null,"url":null,"abstract":"The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Alternative bumping processes for DRAM-CSP\",\"authors\":\"R. Biedorf, R. Heinze, A. Wollanke, K. Wolter, T. Zerna, A. Plotzke\",\"doi\":\"10.1109/ECTC.2002.1008299\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008299\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008299","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

通常在印刷电路板上组装CSP需要在非常小的间距中使用相对大量的锡膏。这就是为什么采用多步骤工艺，使用预成型的焊锡球撞击中间层，在基板上丝网印刷锡膏，并采用回流焊接步骤。本文讨论了CSP碰撞的三种变体，并给出了优化CSP碰撞和装配过程的一些结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Alternative bumping processes for DRAM-CSP

The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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