{"title":"硅通孔在毫米波硅基天线中的应用","authors":"Zhou Dali, Yang Jiapeng, Zhou Jun, Shen Ya","doi":"10.1109/ICAM.2017.8242194","DOIUrl":null,"url":null,"abstract":"Through silicon vias (TSVs) are arranged to form a rectangular resonant cavity to improve performance of silicon based antenna in this paper. On the basis of fundamental theory of rectangular resonant cavity, the model of cavity made of through silicon vias is analyzed. Considering the size of millimeter-wave antenna, the three dimensions of cavity for mode TE101 is calculated. Applying the resonant cavity on coplanar waveguide (CPW) coupled slot antenna, a new frequency is generated which can lead to dual bands or a wider bandwidth. And the radiation gain can be improved by 1.9dB. So the application of through silicon via on improving performances of silicon based antenna is effective enough.","PeriodicalId":117801,"journal":{"name":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2017-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Application of through silicon vias on millimeter-wave silicon based antenna\",\"authors\":\"Zhou Dali, Yang Jiapeng, Zhou Jun, Shen Ya\",\"doi\":\"10.1109/ICAM.2017.8242194\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Through silicon vias (TSVs) are arranged to form a rectangular resonant cavity to improve performance of silicon based antenna in this paper. On the basis of fundamental theory of rectangular resonant cavity, the model of cavity made of through silicon vias is analyzed. Considering the size of millimeter-wave antenna, the three dimensions of cavity for mode TE101 is calculated. Applying the resonant cavity on coplanar waveguide (CPW) coupled slot antenna, a new frequency is generated which can lead to dual bands or a wider bandwidth. And the radiation gain can be improved by 1.9dB. So the application of through silicon via on improving performances of silicon based antenna is effective enough.\",\"PeriodicalId\":117801,\"journal\":{\"name\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICAM.2017.8242194\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICAM.2017.8242194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application of through silicon vias on millimeter-wave silicon based antenna
Through silicon vias (TSVs) are arranged to form a rectangular resonant cavity to improve performance of silicon based antenna in this paper. On the basis of fundamental theory of rectangular resonant cavity, the model of cavity made of through silicon vias is analyzed. Considering the size of millimeter-wave antenna, the three dimensions of cavity for mode TE101 is calculated. Applying the resonant cavity on coplanar waveguide (CPW) coupled slot antenna, a new frequency is generated which can lead to dual bands or a wider bandwidth. And the radiation gain can be improved by 1.9dB. So the application of through silicon via on improving performances of silicon based antenna is effective enough.
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