{"title":"积分方程求解器中四边形基近奇异积分的求值","authors":"C. Luo, Giacomo Bianconi, Swagato Chakraborty","doi":"10.1109/EDAPS.2016.7874405","DOIUrl":null,"url":null,"abstract":"The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Evaluation of near-singular integrals for quadrilateral basis in integral equation solver\",\"authors\":\"C. Luo, Giacomo Bianconi, Swagato Chakraborty\",\"doi\":\"10.1109/EDAPS.2016.7874405\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.\",\"PeriodicalId\":191549,\"journal\":{\"name\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"82 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2016.7874405\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7874405","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evaluation of near-singular integrals for quadrilateral basis in integral equation solver
The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.
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