{"title":"晶圆制造中缺陷检测的良率与可靠性互补激励","authors":"L. Sheng, Wei Pan, Zdenek Axman, V. Bucek","doi":"10.1109/ASMC.2019.8791821","DOIUrl":null,"url":null,"abstract":"Yield defects and reliability defects in wafer- manufacturing are often related. To vividly illustrate in detail the complementary incentives of yield and reliability, we have provided in this paper a case study of ensuring the defect detections. In addition, an extensive review was also provided for the first time from I-V characteristics of defects to stress test failures at product sort. Our broad and multidisciplinary efforts have safeguarded the defect detections in quality manufacturing.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Complementary Incentives of Yield and Reliability for Ensuring Defect Detections in Wafer-Manufacturing\",\"authors\":\"L. Sheng, Wei Pan, Zdenek Axman, V. Bucek\",\"doi\":\"10.1109/ASMC.2019.8791821\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Yield defects and reliability defects in wafer- manufacturing are often related. To vividly illustrate in detail the complementary incentives of yield and reliability, we have provided in this paper a case study of ensuring the defect detections. In addition, an extensive review was also provided for the first time from I-V characteristics of defects to stress test failures at product sort. Our broad and multidisciplinary efforts have safeguarded the defect detections in quality manufacturing.\",\"PeriodicalId\":287541,\"journal\":{\"name\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2019.8791821\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Complementary Incentives of Yield and Reliability for Ensuring Defect Detections in Wafer-Manufacturing
Yield defects and reliability defects in wafer- manufacturing are often related. To vividly illustrate in detail the complementary incentives of yield and reliability, we have provided in this paper a case study of ensuring the defect detections. In addition, an extensive review was also provided for the first time from I-V characteristics of defects to stress test failures at product sort. Our broad and multidisciplinary efforts have safeguarded the defect detections in quality manufacturing.