晶圆制造中缺陷检测的良率与可靠性互补激励

L. Sheng, Wei Pan, Zdenek Axman, V. Bucek
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引用次数: 0

摘要

在晶圆制造中,良率缺陷和可靠性缺陷经常是相互关联的。为了生动地详细说明良率和可靠性的互补激励,我们在本文中提供了一个确保缺陷检测的案例研究。此外,还首次提供了从缺陷的I-V特征到产品分类的压力测试失败的广泛审查。我们广泛和多学科的努力保证了质量制造中的缺陷检测。
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Complementary Incentives of Yield and Reliability for Ensuring Defect Detections in Wafer-Manufacturing
Yield defects and reliability defects in wafer- manufacturing are often related. To vividly illustrate in detail the complementary incentives of yield and reliability, we have provided in this paper a case study of ensuring the defect detections. In addition, an extensive review was also provided for the first time from I-V characteristics of defects to stress test failures at product sort. Our broad and multidisciplinary efforts have safeguarded the defect detections in quality manufacturing.
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