埋在高速塑料封装中的耦合键合线的宽带串扰分析

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634046

Sang-Ki Yun, Hai-Young Lee

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引用次数: 3

摘要

利用全波矩量法(MoM)和FFT算法分析了塑料封装用键合导线中皮秒脉冲的串扰，表明SPICE的静态串扰模型不适合高速封装设计。由于介质和辐射效应增强了相互电磁耦合，塑料封装材料显著增加了键合线串扰。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages

Crosstalk of picosecond pulses in bondwires for plastic packaging is analyzed using the full-wave method of moments (MoM) and the FFT algorithm, showing that the static crosstalk model of SPICE is inappropriate for the high-speed package design. Plastic packaging materials significantly increase bondwire crosstalk due to the mutual electromagnetic coupling enhanced by the dielectric and radiation effects.

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Electrical Performance of Electronic Packaging

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