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引用次数: 8
摘要
提出了一种基于多芯片多核(MCMC)架构的60ghz天线自由空间无线传输方案。60GHz天线配置采用封装天线(Antenna in package, AiP)方案，采用低温共烧陶瓷(LTCC)衬底设计，可通过倒装芯片技术与硅电路连接。所设计的天线具有接地屏蔽结构和人工磁导体(AMC)，能够以较高的辐射效率传输方位面信号。
Wireless RF data communications using 60 GHz antennas in Multi-Core systems
Free space wireless transmission via the 60 GHz antenna in the Multi-Chip Multi-Core (MCMC) architecture is proposed in this paper. Antenna in package (AiP) solution is chosen as the 60GHz antenna configuration and the antenna is designed based on low temperature co-fired ceramic (LTCC) superstrate that could connect to the silicon circuitry via the flip-chip technology. The designed antenna having ground shielded structures and the artificial magnetic conductor (AMC) will demonstrate the azimuth plane signal transmission with the high radiation efficiency.
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