基于TSV的三维集成电路中的分布式多TSV三维时钟分配网络

Dayoung Kim, Joohee Kim, Jonghyun Cho, J. Pak, Joungho Kim, Hyungdong Lee, Junho Lee, Kunwoo Park
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引用次数: 8

摘要

随着基于tsv的三维集成电路(3D IC)技术的迅速发展,需要研究一种基于tsv的三维时钟分配网络(3D CDN)的低倾斜、低抖动、低功耗和小面积消耗的新方案。本文提出了一种分布式多tsv 3D CDN (DMT 3D CDN)结构,并对其倾斜、抖动、功耗和面积消耗进行了分析。提出的DMT 3D CDN在降低功耗的同时,改善了歪斜、抖动和面积消耗的性能。
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Distributed multi TSV 3D clock distribution network in TSV-based 3D IC
As TSV-based three-dimensional integrated circuit (3D IC) technology advances rapidly, research on a new scheme for a three-dimensional clock distribution network (3D CDN) in TSV-based 3D IC with low skew, low jitter, low power consumption and small area consumption is needed. In this paper, we propose a new 3D CDN structure with distributed multi-TSV 3D CDN (DMT 3D CDN), and analyze the skew, jitter, power and area consumption. The proposed DMT 3D CDN improves the performance of the skew, jitter and area consumption, although the power consumption is degraded.
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