液晶聚合物与铜直接键合的键合机理及电化学阻抗

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947436

Taufique Z. Redhwan, Arif Ul Alam, Y. Haddara, M. Howlader

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引用次数: 3

摘要

本文首次报道了用于电化学传感的液晶聚合物与铜膜的直接键合。剥离强度为683 g/cm，附着力强。利用x射线光电子谱和电化学阻抗谱对传感电极进行了表征。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Bonding mechanism and electrochemical impedance of directly bonded liquid crystal polymer and copper

We report direct bonding of liquid crystal polymer and copper film for electrochemical sensing for the first time. A peel strength of 683 g/cm was observed indicating strong adhesion. X-ray photoelectron and electrochemical impedance spectroscopies were used to characterize the sensing electrodes.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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