柔性Vth finfet与9纳米厚极薄盒

K. Endo, S. Migita, Y. Ishikawa, Y. Liu, T. Matsukawa, S. O'Uchi, J. Tsukada, W. Mizubayashi, Y. Morita, H. Ota, H. Yamauchi, M. Masahara
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引用次数: 3

摘要

我们首次在世界上最薄的9纳米厚的极薄(ET) BOX SOI衬底上成功制造了第v个可控连接多栅极FinFET。实验证明,通过控制后置(衬底)偏置,ETBOX上FinFET的Vth可以灵活地从低Vth调整到高Vth,同时保持低亚阈值斜率。
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Flexible Vth FinFETs with 9-nm-thick extremely-thin BOX
For the first time, we have successfully fabricated the Vth controllable connected multigate FinFET on the world's thinnest 9-nm-thick extremely thin (ET) BOX SOI substrate. It was experimentally demonstrated that, by controlling the back (substrate) bias, the Vth of the FinFET on the ETBOX is flexibly tuned from low Vth to high Vth with keeping low sub-threshold slope.
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