考虑信号完整性的8K电视HDMI 2.1接口设计与测量

Gapyeol Park, Hyunwook Park, Daehwan Lho, Junyong Park, Kyungjune Son, Seongguk Kim, Taein Shin, Keeyoung Son, Joonsang Park, Joungho Kim, Junho Lee, Seong-Joon Choi
{"title":"考虑信号完整性的8K电视HDMI 2.1接口设计与测量","authors":"Gapyeol Park, Hyunwook Park, Daehwan Lho, Junyong Park, Kyungjune Son, Seongguk Kim, Taein Shin, Keeyoung Son, Joonsang Park, Joungho Kim, Junho Lee, Seong-Joon Choi","doi":"10.1109/EDAPS50281.2020.9312909","DOIUrl":null,"url":null,"abstract":"In this paper, we propose the design of a HDMI 2.1 connector for 8K TV considering signal integrity (SI). Also, we firstly measure the proposed HDMI 2.1 connector. To achieve the high data rate, connector should be designed by considering not only mechanical characteristics but also electrical characteristics. We design the HDMI 2.1 connector considering SI including characteristic impedance, differential insertion loss and attenuation to crosstalk ratio (ACR). We revise the structure of metal pins and dielectric materials for improving the SI performances. Proposed HDMI 2.1 connector was verified by time-domain and frequency domain simulation using the 3D electromagnetic (EM) simulator. Proposed HDMI 2.1 connector showed improve SI performance than previous connector. Also, proposed connector was verified through measurement. With the proposed HDMI design, it shows better SI characteristics at the 24 Gbps which is expected to next generation HDMI connector’s data rate.","PeriodicalId":137699,"journal":{"name":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity\",\"authors\":\"Gapyeol Park, Hyunwook Park, Daehwan Lho, Junyong Park, Kyungjune Son, Seongguk Kim, Taein Shin, Keeyoung Son, Joonsang Park, Joungho Kim, Junho Lee, Seong-Joon Choi\",\"doi\":\"10.1109/EDAPS50281.2020.9312909\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose the design of a HDMI 2.1 connector for 8K TV considering signal integrity (SI). Also, we firstly measure the proposed HDMI 2.1 connector. To achieve the high data rate, connector should be designed by considering not only mechanical characteristics but also electrical characteristics. We design the HDMI 2.1 connector considering SI including characteristic impedance, differential insertion loss and attenuation to crosstalk ratio (ACR). We revise the structure of metal pins and dielectric materials for improving the SI performances. Proposed HDMI 2.1 connector was verified by time-domain and frequency domain simulation using the 3D electromagnetic (EM) simulator. Proposed HDMI 2.1 connector showed improve SI performance than previous connector. Also, proposed connector was verified through measurement. With the proposed HDMI design, it shows better SI characteristics at the 24 Gbps which is expected to next generation HDMI connector’s data rate.\",\"PeriodicalId\":137699,\"journal\":{\"name\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS50281.2020.9312909\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS50281.2020.9312909","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在本文中,我们提出了一种考虑信号完整性(SI)的8K电视HDMI 2.1连接器的设计。此外,我们首先测量了提议的HDMI 2.1连接器。为了实现高数据速率,连接器的设计不仅要考虑机械特性,还要考虑电气特性。我们在设计HDMI 2.1连接器时考虑了SI,包括特性阻抗、差分插入损耗和串扰衰减比(ACR)。我们修改了金属引脚和介电材料的结构,以提高SI性能。利用三维电磁模拟器对所提出的HDMI 2.1连接器进行时域和频域仿真验证。所提出的HDMI 2.1连接器的SI性能比以前的连接器有所提高。并通过测量对所提出的连接器进行了验证。通过提出的HDMI设计,它在24 Gbps的数据速率下显示出更好的SI特性,这有望达到下一代HDMI连接器的数据速率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity
In this paper, we propose the design of a HDMI 2.1 connector for 8K TV considering signal integrity (SI). Also, we firstly measure the proposed HDMI 2.1 connector. To achieve the high data rate, connector should be designed by considering not only mechanical characteristics but also electrical characteristics. We design the HDMI 2.1 connector considering SI including characteristic impedance, differential insertion loss and attenuation to crosstalk ratio (ACR). We revise the structure of metal pins and dielectric materials for improving the SI performances. Proposed HDMI 2.1 connector was verified by time-domain and frequency domain simulation using the 3D electromagnetic (EM) simulator. Proposed HDMI 2.1 connector showed improve SI performance than previous connector. Also, proposed connector was verified through measurement. With the proposed HDMI design, it shows better SI characteristics at the 24 Gbps which is expected to next generation HDMI connector’s data rate.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Gaussian Process surrogate model for variability analysis of RF circuits Power Distribution Network Optimization for On-Die Regulator with Laplace Transform Technique Multiphysics challenges with Heterogeneous Integrated Voltage Regulator based Power Delivery Architectures Sub-picosecond Skew Matching On Die SSN Methodology for High Speed IO
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1