180nm BCD技术的植入优化

B. Greenwood, J. Kimball, S. Sridaran, K. Truong, A. Lee, S. Menon, J. Gambino, L. Jastrzebski, G. Nadudvari, L. Roszol, M. Nagy, G. Molnár, Z. Kiss, A. Pongrácz, J. Byrnes
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引用次数: 1

摘要

180nm双极- cmos - dmos (BCD)技术的关键部分是使用高beta的PNP双极器件。宏微光致发光成像(MacroPL, μPL)利用高强度光照激发半导体中的载流子,然后观察辐射复合产生的更长波长的光子;波段到波段和缺陷到波段的发射都被使用。使用微光致发光成像可以快速表征和纠正位错和其他抑制PNP β的缺陷。
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Implant Optimization for a 180nm BCD Technology
A key part of 180nm Bipolar-CMOS-DMOS (BCD) technology is the use of PNP bipolar devices with high beta. Macro and Micro Photoluminescence Imaging (MacroPL, μPL) uses excitation of charge carriers in semiconductor by high intensity illumination, followed by observation of photons at longer wavelength generated from radiative recombination; both band to band and defect to band emissions were used. Use of Micro Photoluminescence Imaging allows rapid characterization and corrective actions for dislocations and other defects which suppress PNP beta.
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