{"title":"双面冷却","authors":"G. Feix, M. Hutter, E. Hoene, K. Lang","doi":"10.1109/ESTC.2014.6962724","DOIUrl":null,"url":null,"abstract":"Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On double sided cooling\",\"authors\":\"G. Feix, M. Hutter, E. Hoene, K. Lang\",\"doi\":\"10.1109/ESTC.2014.6962724\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962724\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962724","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.
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