一种新的简单的自对准绝缘体上硅(SOI)混合集成概念

First IEEE International Conference on Group IV Photonics, 2004. Pub Date : 2004-09-29 DOI:10.1109/GROUP4.2004.1416719

T. Mitze, M. Schnarrenberger, L. Zimmermann, J. Bruns, F. Fidorra, F. Kreissl, K. Janiak, H. Heidrich, K. Petermann

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引用次数: 2

摘要

介绍了SOI主板的概念。AuSn焊料技术用于混合集成。板上的器件调整是通过无源自对准实现的。初步结果是非常令人鼓舞的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A new and simple concept for self-aligned hybrid integration in silicon on insulator (SOI)

A concept for a SOI motherboard is introduced. AuSn solder technology is used for hybrid integration. The device adjustment on the board is realised by passive self-alignment. First results on fabricated boards are very encouraging.

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First IEEE International Conference on Group IV Photonics, 2004.

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