Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh
{"title":"带执行器的智能套装布线与安装结构研究","authors":"Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh","doi":"10.23919/ICEP55381.2022.9795521","DOIUrl":null,"url":null,"abstract":"This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on Wiring and Mounting Structures for Smart Suits with Actuators\",\"authors\":\"Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh\",\"doi\":\"10.23919/ICEP55381.2022.9795521\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795521\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795521","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study on Wiring and Mounting Structures for Smart Suits with Actuators
This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.