带执行器的智能套装布线与安装结构研究

Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh
{"title":"带执行器的智能套装布线与安装结构研究","authors":"Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh","doi":"10.23919/ICEP55381.2022.9795521","DOIUrl":null,"url":null,"abstract":"This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on Wiring and Mounting Structures for Smart Suits with Actuators\",\"authors\":\"Takuma Takagi, J. Nakagawa, S. Takamatsu, Toshihiro Itoh\",\"doi\":\"10.23919/ICEP55381.2022.9795521\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795521\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795521","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本研究旨在开发一种智能服装,它可以在恒定的压力下将振动马达压在身体上,为整个身体提供触觉反馈。提出了超弹性泡沫结构。压力稳定在1.5 ~ 2.0 kPa。提出了导电纤维与柔性印制板相结合的布线结构,以防止移动和破损。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Study on Wiring and Mounting Structures for Smart Suits with Actuators
This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Strain-Induced Change in the Photonic Properties of Dumbbell-Shaped Graphene Nanoribbon Structures Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers Low temperature interconnects in 1st level packaging and its challenges Advanced Low Dk and High-Density Photo- Imageable Dielectrics for RDL Interposer Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1