Aschenbrenner, F. Ansorge, M. Feil, C. Landesberger, E. Jung, A. Ostmann, H. Reichl
{"title":"超薄封装技术的概念","authors":"Aschenbrenner, F. Ansorge, M. Feil, C. Landesberger, E. Jung, A. Ostmann, H. Reichl","doi":"10.1109/ADHES.2000.860565","DOIUrl":null,"url":null,"abstract":"As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Concepts for ultra thin packaging technologies\",\"authors\":\"Aschenbrenner, F. Ansorge, M. Feil, C. Landesberger, E. Jung, A. Ostmann, H. Reichl\",\"doi\":\"10.1109/ADHES.2000.860565\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.\",\"PeriodicalId\":222663,\"journal\":{\"name\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"volume\":\"150 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.2000.860565\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860565","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
As the number of applications for flexible assemblies is growing there is also a larger variation of requirements for such packages. Therefore different technologies have been developed for applications from CSP's to smart cards. The scope of the paper is to describe different approaches for packaging using ultra-thin and flexible chips. This includes the assembly processes as well as packaging concepts e.g. CSP's, 3D modules and volumetric integration of passive and active components into modules and substrates.
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