{"title":"高温应用的金属丝键合技术","authors":"J. Freytag, I. Wennemuth","doi":"10.1109/ICSICT.1998.785858","DOIUrl":null,"url":null,"abstract":"Palladium (Pd) wire is a favourable metal for wire bonding electronic devices operating an enhanced temperatures. The bonding process was investigated and the significant process parameters were identified. Different parameter sets were worked out for various bonding machines. The separation of the wire after the bonding process was found to be decisive for the quality of the bond. Thermal ageing at enhanced temperatures (i.e. 300/spl deg/C for 1000 h) causes no degradation of the bonds.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"284 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Wire bonding technique for high temperature applications\",\"authors\":\"J. Freytag, I. Wennemuth\",\"doi\":\"10.1109/ICSICT.1998.785858\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Palladium (Pd) wire is a favourable metal for wire bonding electronic devices operating an enhanced temperatures. The bonding process was investigated and the significant process parameters were identified. Different parameter sets were worked out for various bonding machines. The separation of the wire after the bonding process was found to be decisive for the quality of the bond. Thermal ageing at enhanced temperatures (i.e. 300/spl deg/C for 1000 h) causes no degradation of the bonds.\",\"PeriodicalId\":286980,\"journal\":{\"name\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"volume\":\"284 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.1998.785858\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.785858","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wire bonding technique for high temperature applications
Palladium (Pd) wire is a favourable metal for wire bonding electronic devices operating an enhanced temperatures. The bonding process was investigated and the significant process parameters were identified. Different parameter sets were worked out for various bonding machines. The separation of the wire after the bonding process was found to be decisive for the quality of the bond. Thermal ageing at enhanced temperatures (i.e. 300/spl deg/C for 1000 h) causes no degradation of the bonds.
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