粘接机理中的尼龙搭扣概念硅-硅低温直接粘接技术

2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2015-03-02 DOI:10.1109/MEMSYS.2015.7050977

S. Keshavarzi, U. Mescheder, H. Reinecke

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引用次数: 1

摘要

这项工作提出了一种针状表面之间的键合机制，用于室温Si-Si直接键合，类似于尼龙搭扣原理，这是一种完全兼容CMOS的方法，适合使用si主板概念进行系统集成。该粘接模型考虑了湿度效应和针在粘接过程中的变形机制，优于现有的粘接模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique

This work presents a bonding mechanism between needle-like surfaces for room temperature Si-Si direct bonding similar to the Velcro-principle, a fully CMOS compatible approach suitable for system integration using Si-motherboard concept. The proposed bonding model is superior to other presented models since it considers humidity effect and the deformation mechanism of the needles during the bonding.

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2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

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