{"title":"硅绝缘体技术，器件和挑战","authors":"S. Cristoloveanu","doi":"10.1109/COMMAD.1998.791584","DOIUrl":null,"url":null,"abstract":"SOI technologies are reviewed in terms of wafer fabrication, device properties, and development challenges. The basic SOI assets for the microelectronics future are discussed and compared to those of bulk-silicon technology. There are two types of SOI MOSFETs-fully-depleted and partially-depleted-each governed by special mechanisms which will be briefly addressed.","PeriodicalId":300064,"journal":{"name":"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Silicon on insulator technology, devices, and challenges\",\"authors\":\"S. Cristoloveanu\",\"doi\":\"10.1109/COMMAD.1998.791584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SOI technologies are reviewed in terms of wafer fabrication, device properties, and development challenges. The basic SOI assets for the microelectronics future are discussed and compared to those of bulk-silicon technology. There are two types of SOI MOSFETs-fully-depleted and partially-depleted-each governed by special mechanisms which will be briefly addressed.\",\"PeriodicalId\":300064,\"journal\":{\"name\":\"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/COMMAD.1998.791584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMMAD.1998.791584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Silicon on insulator technology, devices, and challenges
SOI technologies are reviewed in terms of wafer fabrication, device properties, and development challenges. The basic SOI assets for the microelectronics future are discussed and compared to those of bulk-silicon technology. There are two types of SOI MOSFETs-fully-depleted and partially-depleted-each governed by special mechanisms which will be briefly addressed.
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