畴边界对氧化镧基栅极电介质介电性能的影响

A. Laha, E. Bugiel, J. X. Wang, H. Osten, A. Fissel
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摘要

在这项工作中,研究了畴边界对沿[110]方位角4°错切Si(001)衬底生长的外延Gd2O3薄膜介电性能的影响。在Si(001)衬底上进行4°错切处理,在特殊条件下制备具有和不具有畴边界的Gd2O3外延层。具有双原子台阶高度梯田的错切衬底表面可能是成功生长单畴Gd2O3外延层的关键点。与具有两个正交畴的外延层相比,无畴边界的Epi-Gd2O3层的泄漏电流明显降低。而对于1 nm以下的电容等效厚度,差异消失,表明在超薄层中,直接隧穿成为主导的传导机制。此外,对这些样品进行成形气体退火处理,无论其结构如何,都可以进一步降低泄漏电流几个数量级。在这里,两种结构类型的薄层表现出相似的电学性质。
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Effect of domain boundaries on dielectric properties of lanthanide oxide based gate dielectrics
In this work, impact of domain boundaries on dielectric properties of epitaxial Gd2O3 thin films grown on Si(001) substrates with 4° miscut along [110] azimuth were studied. Epitaxial Gd2O3 layers with and without domain boundaries could be prepared on same Si(001) substrates with 4° miscut when the surface is prepared under special condition prior to the layer growth. A miscut substrate surface with terraces of biatomic steps height could be the crucial point to be succeeded to grow single domain epitaxial Gd2O3 layer. Epi-Gd2O3 layers without any domain boundaries exhibited significantly lower leakage currents compare to that commonly obtained epitaxial layers with two orthogonal domains. However, for capacitance equivalent thickness below 1 nm, the differences disappear, indicating that for ultra thin layers direct tunneling becomes dominant conduction mechanism. Additionally, a forming gas annealing treatment on these samples could further reduce the leakage current by few orders of magnitudes irrespective of their structure. Here, thinner layers of both structural types exhibited similar electrical properties.
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