电子装配方面的研究需求和机会

L. Martin-Vega, H.K. Brown, W.H. Shaw, T. Sanders
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摘要

本文调查了在研究和开发方面的投资是否会对降低成本和/或提高电子组装的效率产生重大影响。这项研究采用的方法包括工业调查、实地数据收集访问、学术和贸易出版物的文献调查以及与装配领域专家的互动。行业评估是在24条生产线上进行的,这些公司的年销售额从1000万美元到20亿美元不等。大约64%的被调查的装配美元价值对应于国防部产品。本文描述了装配成本在安装、支持和过程活动中的分布。还记录了手工、半自动和自动组装的故障。进行了需求和趋势分析,以确定工业参与者对其当前投资、投资需求和装配活动成本影响潜力的看法。我们针对政府承包商与商业公司、主承包商与次级承包商以及电力密集型作业提出了这些发现。我们的研究方法包括从开放式问题和访谈中分析定性数据。对这些信息进行了内容和词汇分析,确定了三个主要的装配问题:研发机会、研发障碍和技术转移。并对这些发现进行了总结。
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Research needs and opportunities in electronics assembly
This paper investigates whether investments in research and development could have a significant impact in either reducing the cost and/or enhancing the effectiveness of electronics assembly. The methodology followed in this study consisted of industrial surveys, on-site data gathering visits, literature surveys of academic and trade publications, and interaction with experts in the field of assembly. The industrial assessment was conducted on 24 product lines across companies ranging in size from $10 million to $2 billion in annual sales. Approximately 64% of the assembly dollar value surveyed corresponded to DoD products. This paper describes the distribution of assembly cost across setup, support, and process activities. Breakdowns by manual, semi-automated, and automated assembly are also documented. A needs and trend analysis was conducted to determine the perception of the industrial participants regarding their current investment, need for investment and cost impact potential of assembly activities. We present these findings for government contractors versus commercial firms, prime contractors versus sub-tier contractors, and for electrically intense operations. Our research methodology included the analysis of qualitative data from open-ended questions and interviews. This information was subjected to content and lexical analysis and identified three major assembly issues: R&D opportunities, R&D inhibitors, and technology transfer. These findings are also summarized.
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