高速串行链路挑战使用多级信令

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2016-12-01 DOI:10.1109/EDAPS.2016.7874408

N. Dikhaminjia, J. He, E. Hernandez, M. Tsiklauri, J. Drewniak, A. Chada, M. Zvonkin, B. Mutnury

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引用次数: 6

摘要

本文讨论了使用多级信令的高速串行链路所面临的挑战，并比较了使用不同损耗材料和均衡选项的各种信道的性能。根据测试结果，指出了多级信令的优点和存在的问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High-speed serial link challenges using multi-level signaling

The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.

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2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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