{"title":"从模具背面定位电气故障:使用红外发射显微镜的故障分析案例研究","authors":"M. Bailon, A. Tarun, M. Nery, J. Munoz","doi":"10.1109/IPFA.2003.1222764","DOIUrl":null,"url":null,"abstract":"We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.","PeriodicalId":266326,"journal":{"name":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Localization of electrical failures from the backside of the die: Failure Analysis case studies using infrared emission microscope\",\"authors\":\"M. Bailon, A. Tarun, M. Nery, J. Munoz\",\"doi\":\"10.1109/IPFA.2003.1222764\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.\",\"PeriodicalId\":266326,\"journal\":{\"name\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-07-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2003.1222764\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2003.1222764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Localization of electrical failures from the backside of the die: Failure Analysis case studies using infrared emission microscope
We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.