{"title":"使用室温粘合的二维材料转移","authors":"T. Matsumae, T. Suga","doi":"10.23919/LTB-3D.2017.7947451","DOIUrl":null,"url":null,"abstract":"This study investigates the use of room temperature bonding for layer transfer process to reduce contaminants on a transferred material. It was found that resist residues on transferred graphene were significantly reduced using surface activated bonding at room temperature in comparison of thermal compression bonding at 250 °C. Surface activated bonding can provide a platform for layer transfer process suitable for 2D materials integration.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"34-35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"2D material transfer using room temperature bonding\",\"authors\":\"T. Matsumae, T. Suga\",\"doi\":\"10.23919/LTB-3D.2017.7947451\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study investigates the use of room temperature bonding for layer transfer process to reduce contaminants on a transferred material. It was found that resist residues on transferred graphene were significantly reduced using surface activated bonding at room temperature in comparison of thermal compression bonding at 250 °C. Surface activated bonding can provide a platform for layer transfer process suitable for 2D materials integration.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"34-35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947451\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947451","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
2D material transfer using room temperature bonding
This study investigates the use of room temperature bonding for layer transfer process to reduce contaminants on a transferred material. It was found that resist residues on transferred graphene were significantly reduced using surface activated bonding at room temperature in comparison of thermal compression bonding at 250 °C. Surface activated bonding can provide a platform for layer transfer process suitable for 2D materials integration.
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