{"title":"定制集成电路生产线的成品率建模","authors":"P. Fang","doi":"10.1109/ASMC.1990.111226","DOIUrl":null,"url":null,"abstract":"A methodology used to implement yield modeling in a custom integrated-circuit manufacturing facility is described. The sources for the inputs to the models are described. The component approach to yield modeling is explained, where component defect density (D/sub 0/) information is used to build an overall yield prediction. A reverse model using a single D/sub 0/ number is detailed. Verifications and selection criteria are given for model selection.<<ETX>>","PeriodicalId":158760,"journal":{"name":"IEEE/SEMI Conference on Advanced Semiconductor Manufacturing Workshop","volume":"191 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Yield modeling in a custom IC manufacturing line\",\"authors\":\"P. Fang\",\"doi\":\"10.1109/ASMC.1990.111226\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A methodology used to implement yield modeling in a custom integrated-circuit manufacturing facility is described. The sources for the inputs to the models are described. The component approach to yield modeling is explained, where component defect density (D/sub 0/) information is used to build an overall yield prediction. A reverse model using a single D/sub 0/ number is detailed. Verifications and selection criteria are given for model selection.<<ETX>>\",\"PeriodicalId\":158760,\"journal\":{\"name\":\"IEEE/SEMI Conference on Advanced Semiconductor Manufacturing Workshop\",\"volume\":\"191 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-09-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE/SEMI Conference on Advanced Semiconductor Manufacturing Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1990.111226\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/SEMI Conference on Advanced Semiconductor Manufacturing Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1990.111226","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A methodology used to implement yield modeling in a custom integrated-circuit manufacturing facility is described. The sources for the inputs to the models are described. The component approach to yield modeling is explained, where component defect density (D/sub 0/) information is used to build an overall yield prediction. A reverse model using a single D/sub 0/ number is detailed. Verifications and selection criteria are given for model selection.<>