高温下电子器件中键合线材料的力学特性

G. Lorenz, F. Naumann, M. Mittag, M. Petzold
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引用次数: 1

摘要

今天,微型和电力电子元件被用于越来越多的不同汽车应用中,在发电和能量转换系统中发挥着关键作用。因此,特别是电子系统的互连材料受到恶劣环境条件的极大挑战,例如高工作温度,这些恶劣环境条件部分由密集的机械负载和高热机械应力叠加。为了满足工业应用所需的鲁棒性和可靠性要求,有必要详细了解材料的(粘)弹性、塑性或蠕变变形行为随温度的变化。在这项研究中,通过纳米压痕测定了键合线材料在高达350°C温度下的弹性和塑性材料性能。利用voice模型考虑材料的塑性行为,以三种不同的重键线材料为模型系统,举例说明了所应用的材料参数提取过程。通过对比参考拉伸试验结果和纳米压痕试验结果,验证了所提出的试验方法的有效性。因此,测试方法和数据评估程序也可以应用于确定微电子封装材料关键工艺或应用影响区域的局部材料参数。
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Mechanical characterization of bond wire materials in electronic devices at elevated temperatures
Today, micro- and power electronic components are used within a rapidly increasing number of different automotive applications playing a key role within power generation and energy conversion systems. As a consequence, particularly the interconnecting materials of electronics systems are extremely challenged by harsh environment conditions like high operational temperatures, which are partially superposed by intensive mechanical loading and high thermo mechanical stresses. In order to meet the robustness and reliability demands required for industrial applications, detailed understanding of the material response regarding (visco-) elastic, plastic or creep deformation behavior as a function of temperature is necessary. In this study, elastic and plastic material properties of bond wire materials at temperatures up to 350°C have been determined by nanoindentation. Using a Voce model to consider the plastic material behavior, the applied material parameter extraction procedure was exemplarily demonstrated for three different heavy bond wire materials as a model system. The test method presented has been validated by comparing results from reference tensile testing with the deformation behavior gained from nanoindentation testing. Thus, the testing method and data evaluation procedure can also be applied to determine local material parameters in critical process- or application-affected regions of microelectronic packaging materials.
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