{"title":"镍铜合金电沉积形成异形镀层","authors":"T. Kobayashi, A. Kubo, I. Shohji","doi":"10.23919/ICEP55381.2022.9795387","DOIUrl":null,"url":null,"abstract":"In this study, Ni-Cu electrodeposited film with three-dimensional structures was formed by controlling potential using a plating solution which is a mixture of Ni amidosulfate and Cu sulfate. When the concentration ratio of Ni amidosulfate to Cu sulfate was set to 150-450:15 (g/L) and the potential was set to -1.0 to -1.5 V, the electrodeposited film had dendritic morphology.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Formation of Specially Shaped Plating Film by Nickel-Copper Alloy Electrodeposition\",\"authors\":\"T. Kobayashi, A. Kubo, I. Shohji\",\"doi\":\"10.23919/ICEP55381.2022.9795387\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, Ni-Cu electrodeposited film with three-dimensional structures was formed by controlling potential using a plating solution which is a mixture of Ni amidosulfate and Cu sulfate. When the concentration ratio of Ni amidosulfate to Cu sulfate was set to 150-450:15 (g/L) and the potential was set to -1.0 to -1.5 V, the electrodeposited film had dendritic morphology.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795387\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795387","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Formation of Specially Shaped Plating Film by Nickel-Copper Alloy Electrodeposition
In this study, Ni-Cu electrodeposited film with three-dimensional structures was formed by controlling potential using a plating solution which is a mixture of Ni amidosulfate and Cu sulfate. When the concentration ratio of Ni amidosulfate to Cu sulfate was set to 150-450:15 (g/L) and the potential was set to -1.0 to -1.5 V, the electrodeposited film had dendritic morphology.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
