{"title":"300毫米自动化晶圆厂统一工具通讯规范","authors":"S. Kono, T. Masui, Y. Ohyama","doi":"10.1109/ISSM.2001.962905","DOIUrl":null,"url":null,"abstract":"In 300 mm diameter wafer fabrication line, concrete infrastructure that enables high degree of line operation is essential to minimize the cost and the risk of new 300 mm fab infrastructure and integration. Equipment online communication is an essential technology as fab infrastructure. Based on CIM-GJG and SEMI standards, Selete (Semiconductor Leading Edge Technologies, Inc.) has been developed unified process tool communication specification and its test specification at implementation level. These specifications will be used as base specifications among device makers and give directions of design and implementation at equipment suppliers.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Unified tool communication specification for 300 mm automated fab\",\"authors\":\"S. Kono, T. Masui, Y. Ohyama\",\"doi\":\"10.1109/ISSM.2001.962905\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In 300 mm diameter wafer fabrication line, concrete infrastructure that enables high degree of line operation is essential to minimize the cost and the risk of new 300 mm fab infrastructure and integration. Equipment online communication is an essential technology as fab infrastructure. Based on CIM-GJG and SEMI standards, Selete (Semiconductor Leading Edge Technologies, Inc.) has been developed unified process tool communication specification and its test specification at implementation level. These specifications will be used as base specifications among device makers and give directions of design and implementation at equipment suppliers.\",\"PeriodicalId\":356225,\"journal\":{\"name\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2001.962905\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2001.962905","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
在直径300毫米的晶圆生产线中，混凝土基础设施能够实现高度的生产线操作，这对于最小化新的300毫米晶圆厂基础设施和集成的成本和风险至关重要。设备在线通信是晶圆厂基础设施的一项重要技术。Selete (Semiconductor Leading Edge Technologies, Inc.)基于CIM-GJG和SEMI标准，在实施层面制定了统一的工艺工具通信规范及其测试规范。这些规范将作为设备制造商之间的基本规范，并为设备供应商的设计和实施提供指导。
Unified tool communication specification for 300 mm automated fab
In 300 mm diameter wafer fabrication line, concrete infrastructure that enables high degree of line operation is essential to minimize the cost and the risk of new 300 mm fab infrastructure and integration. Equipment online communication is an essential technology as fab infrastructure. Based on CIM-GJG and SEMI standards, Selete (Semiconductor Leading Edge Technologies, Inc.) has been developed unified process tool communication specification and its test specification at implementation level. These specifications will be used as base specifications among device makers and give directions of design and implementation at equipment suppliers.
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