{"title":"FOWLP技术中的77GHz空腔支持AiP阵列","authors":"S. Mei, Lim Teck Guan, Chai Tai Chong","doi":"10.1109/ectc51906.2022.00022","DOIUrl":null,"url":null,"abstract":"This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"77GHz Cavity-Backed AiP Array in FOWLP Technology\",\"authors\":\"S. Mei, Lim Teck Guan, Chai Tai Chong\",\"doi\":\"10.1109/ectc51906.2022.00022\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.\",\"PeriodicalId\":139520,\"journal\":{\"name\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ectc51906.2022.00022\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.
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