多级金属化铜damascend工艺的独特缺陷及分析

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222712

Z.G. Song, S. K. Loh, M. Gunawardana, C. Oh, S. Redkar

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引用次数: 2

摘要

本文介绍了铜金属化开发过程中遇到的一些缺陷及其失效分析方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Unique defects and analyses with copper damascene process for multilevel metallization

In this paper, we present some defects encountered and the involved failure analysis methods for these defects during copper metallization development.

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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