专题会议:热点议题:统计检验方法

M. Barragán, G. Léger, F. Azaïs, R. D. Blanton, A. Singh, S. Sunter
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引用次数: 0

摘要

测试集成电路的过程涉及大量数据:电路测量、晶圆过程监视器的信息、芯片的空间位置、晶圆批号等。此外,故障、工艺变化和电路性能之间的关系可能是非常复杂和非线性的。测试(及其扩展到诊断)应被视为一个具有挑战性的高维度多变量问题。
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Special session: Hot topics: Statistical test methods
The process of testing Integrated Circuits involves a huge amount of data: electrical circuit measurements, information from wafer process monitors, spatial location of the dies, wafer lot numbers, etc. In addition, the relationships between faults, process variations and circuit performance are likely to be very complex and non-linear. Test (and its extension to diagnosis) should be considered as a challenging highly dimensional multivariate problem.
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