轻掺铁n型InP晶圆中与退火相关的电导率转换

R. Fornari, A. Zappettini, E. Gombia, R. Mosca, M. Curti
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引用次数: 1

摘要

生长的半导体InP晶圆含铁量在5到8/spl倍/10/sup 15/ cm/sup -3/之间,经过900/spl℃的热处理后,可以转化为半绝缘,具有高电阻率和良好的迁移率。这一事实很有趣,因为它允许制备半绝缘InP,其铁含量大大低于标准LEC材料。在本文中,我们报告了退火参数和处理后样品的广泛电光表征结果。实验结果表明,电导率下降的主要原因是浅层供体的大量损失。
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Annealing-related conductivity conversion in lightly Fe-doped n-type InP wafers
As-grown semiconducting InP wafers containing iron at a level between 5 and 8/spl times/10/sup 15/ cm/sup -3/ were seen to convert to semi-insulating, with high resistivity and good mobility, after a thermal treatment at 900/spl deg/C. This fact is interesting since it allows the preparation of semi-insulating InP with Fe content substantially lower than in standard LEC material. In this paper we report the annealing parameters and the results of an extensive electro-optical characterization of the treated samples. The experimental results suggest that the conductivity drop is mainly due to a considerable loss of shallow donors.
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