电子封装-一个基于网络的课程,为IEEE社区

M. Caggiano, K. M. Ho
{"title":"电子封装-一个基于网络的课程,为IEEE社区","authors":"M. Caggiano, K. M. Ho","doi":"10.1109/ECTC.2002.1008307","DOIUrl":null,"url":null,"abstract":"The authors profile a course that is a Web-based enhancement of a new graduate. course entitled \"Electronics Packaging\" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electronics packaging - a Web-based course for the IEEE community\",\"authors\":\"M. Caggiano, K. M. Ho\",\"doi\":\"10.1109/ECTC.2002.1008307\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors profile a course that is a Web-based enhancement of a new graduate. course entitled \\\"Electronics Packaging\\\" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008307\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008307","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

作者介绍了一门课程,这是一个基于网络的增强新毕业生。名为“电子封装”的课程,该课程于2001年春季开发并引入罗格斯大学ECE系。本课程介绍集成电路封装中寄生器件的电学特性和建模。本课程的目标是电气工程专业的全日制学生和有电路分析背景的工业兼职研究生。作者讨论了这门课程的现状,并展示了一个与包的电寄生有关的Web设计讲座的示例。
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Electronics packaging - a Web-based course for the IEEE community
The authors profile a course that is a Web-based enhancement of a new graduate. course entitled "Electronics Packaging" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.
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